Analytics & X-Ray

Every circuit board, every prototype and every series is checked by us before dispatch using automatic optical inspection (AOI) and spot checks using X-rays.

Specifications

Icon 1

Knowing what's behind it

Every circuit board, every prototype and every series that leaves our company is checked beforehand using AOI (Automatic Optical Inspection). Hidden solder joints (QFNs, BGAs) are spot-checked using X-ray. This enables us to offer you a fast and reliable series start-up.

Icon 2

AOI

In addition to the presence of the components, the AOI also checks their polarity and position, the correct component designation and, of course, the quality of the solder joint.

Icon 3

X-Ray

However, for components with connections on the underside of the component, such as BGAs and QFNs, the solder joints can only be inspected using X-rays. Automatic optical inspection is not sufficient here.

Icon 4

Analytics

With our in-house analytics (fully-fledged grinding laboratory), we are also able to carry out materialographic tests to increase process safety and reliability.

Our service

Workstation with 3D inspection system

Microsection analysis of a BGA ball with PCB connection

Analytical investigation of a capacitor with the material connection to the printed circuit board

Optical inspection of circuit boards and components