Ever smaller, ever lighter, ever more densely populated - and therefore ever more powerful: the ongoing miniaturization of electronic assemblies has many advantages. However, smaller component sizes, finer structures and material thicknesses place higher demands on production and require maximum precision.
Our fully automated SMT production in the clean room meets this challenge of precision and accuracy. The flexible placement line consists of six stencil printers and eight automatic placement machines, achieving an output of approx. 200,000 components per hour. Five vapor phase and one convection soldering system are used for the soldering process.
Through-hole technology (THT) works with significantly larger pitches than SMT production, depending on the type of housing. No wonder that THT components are increasingly having to make way for the densely packed and usually much lighter SMT designs. Nevertheless, they still have their place - e.g. in power electronics or connectors.
In order to be able to serve our portfolio from simple series products to complex prototypes, we use wave and selective soldering systems for the entire range of THT components in addition to the classic manual soldering process.
Vapor phase soldering
Feeder with component rollers
SMT assembly
Nozzle for holding the component